No. |
Items |
Standard Specification |
1 |
Size |
2″ |
3″ |
4″ |
6″ |
2 |
Diameter mm |
50.8±0.3 |
76.2±0.3 |
100±0.5 |
150±0.5 |
3 |
Growth Method |
VGF |
VGF |
VGF |
VGF |
4 |
Conductivity Type |
P/Zn, N/Si, Semi-insulating |
5 |
Orientation |
(100)±0.5° |
(100)±0.5° |
(100)±0.5° |
(100)±0.5° |
6 |
Thickness μm |
350±25 |
625±25 |
625±25 |
650±25 |
7 |
Orientation Flat mm |
17±1 |
22±1 |
32±1 |
Notch |
8 |
Identification Flat mm |
7±1 |
12±1 |
18±1 |
- |
9 |
Resistivity Ω-cm |
(1-9)E(-3) for P or N, (1-10)E8 for semi-insulating |
10 |
Mobility cm2/v.s |
50-120 for P, (1-2.5)E3 for N; ≥4000 for semi-insulating |
11 |
Carrier Concentration cm-3 |
(5-50)E18 for P; (0.8-4)E18 for N |
12 |
TTV μm max |
10 |
10 |
10 |
10 |
13 |
Bow μm max |
30 |
30 |
30 |
30 |
14 |
Warp μm max |
30 |
30 |
30 |
30 |
15 |
EPD cm-2 |
5000 |
5000 |
5000 |
5000 |
16 |
Surface Finish |
P/E, P/P |
P/E, P/P |
P/E, P/P |
P/E, P/P |
17 |
Packing |
Single wafer container sealed in Aluminum bag. |
18 |
Mechanical Grade GaAs wafer regardless of electronic specifications also available. |