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Big discounting Insulator - Gallium Arsenide GaAs – WMC


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Gallium Arsenide GaAs wafers are principally used to fabricate electronic devices such as infrared light-emitting diodes, laser diodes, optical windows, field-effect transistors FETs, linear of digital ICs and solar cells. GaAs components are useful in ultra-high radio frequencies and fast electronic switching application, weak-signal amplification applications. Furthermore, Gallium Arsenide substrate is a ideal material for the manufacture of RF components, microwave frequency and monolithic ICs, and LEDs devices in optical communications and control systems for its saturating hall mobility, high power and temperature stability.

No. Items Standard Specification   
1 Size 2″ 3″ 4″ 6″
2 Diameter mm 50.8±0.3 76.2±0.3 100±0.5 150±0.5
3 Growth Method VGF VGF VGF VGF
4 Conductivity Type  N-Type/Si or Te-doped, P-Type/Zn-doped, Semi-Insulating/Un-doped
5 Orientation (100)±0.5° (100)±0.5° (100)±0.5° (100)±0.5°
6 Thickness μm 350±25 625±25 625±25 650±25
7 Orientation Flat mm 17±1 22±1 32±1 Notch
8 Identification Flat mm 7±1 12±1 18±1 -
9 Resistivity Ω-cm (1-9)E(-3) for p-type or n-type, (1-10)E8 for semi-insulating
10 Mobility cm2/v.s 50-120 for p-type, (1-2.5)E3 for n-type, ≥4000 for semi-insulating
11 Carrier Concentration cm-3 (5-50)E18 for p-type, (0.8-4)E18 for n-type
12 TTV μm max 10 10 10 10
13 Bow μm max 30 30 30 30
14 Warp μm max 30 30 30 30
15 EPD cm-2 5000 5000 5000 5000
16 Surface Finish P/E, P/P P/E, P/P P/E, P/P P/E, P/P
17 Packing Single wafer container sealed in aluminum composite bag.
18 Remarks Mechanical grade GaAs wafer is also available upon request.
Linear Formula GaAs
Molecular Weight 144.64
Crystal structure Zinc blende
Appearance Gray crystalline solid
Melting Point 1400°C, 2550°F
Boiling Point N/A
Density at 300K 5.32 g/cm3
Energy Gap 1.424 eV
Intrinsic resistivity 3.3E8 Ω-cm
CAS Number 1303-00-0
EC Number 215-114-8
  • Sample Available Upon Request 
  • Safety Delivery of Goods By Courier/Air/Sea
  • COA/COC Quality Management
  • Secure & Convenient Packing
  • UN Standard Packing Available Upon Request
  • ISO9001:2015 Certified    
  • CPT/CIP/FOB/CFR Terms By Incoterms 2010
  • Flexible Payment Terms T/T D/P L/C Acceptable
  • Full Dimensional After-Sale Services
  • Quality Inspection By Sate-of-the-art Facility
  • Rohs/REACH Regulations Approval
  • Non-Disclosure Agreements NDA
  • Non-Conflict Mineral Policy
  • Regular Environmental Management Review
  • Social Responsibility Fulfillment
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