Description
Gallium Antimonide GaSb, a semiconductor of the group III–V compounds with zinc-blende lattice structure, is synthesized by 6N 7N high purity gallium and antimony elements, and grown to crystal by LEC method from directionally frozen polycrystalline ingot or VGF method with EPD<1000cm -3. GaSb wafer can be sliced into and fabricated afterward from single crystalline ingot with a high uniformity of electrical parameters, unique and constant lattice structures, and low defect density, highest refractive index than the most other non-metallic compounds. GaSb can be processed with a wide choice in exact or off orientation, low or high doped concentration, good surface finish and for MBE or MOCVD epitaxial growth. Gallium Antimonide substrate is being utilized in the most cutting-edge photo-optic and optoelectronic applications such as the fabrications of photo detectors, infrared detectors with long life, high sensitivity and reliability, photoresist component, infrared LEDs and lasers, transistors, thermal photovoltaic cell and thermo-photovoltaic systems.
Delivery
Gallium Antimonide GaSb at Western Minmetals (SC) Corporation can be offered with n-type, p-type and undoped semi-insulating conductivity in size of 2” 3” and 4” (50mm, 75mm, 100mm) diameter, orientation <111> or <100>, and with wafer surface finish of as-cut, etched, polished or high quality epitaxy ready finishes. All slices are individually laser scribed for identity. Meanwhile, polycrystalline gallium antimonide GaSb lump is also customized upon request to the perfect solution.
Technical Specification
Gallium Antimonide GaSb substrate is being utilized in the most cutting-edge photo-optic and optoelectronic applications such as the fabrications of photo detectors, infrared detectors with long life, high sensitivity and reliability, photoresist component, infrared LEDs and lasers, transistors, thermal photovoltaic cell and thermo-photovoltaic systems.
Items | Standard Specification | |||
1 | Size | 2" | 3" | 4" |
2 | Diameter mm | 50.5±0.5 | 76.2±0.5 | 100±0.5 |
3 | Growth Method | LEC | LEC | LEC |
4 | Conductivity | P-type/Zn-doped, Un-doped, N-type/Te-doped | ||
5 | Orientation | (100)±0.5°, (111)±0.5° | ||
6 | Thickness μm | 500±25 | 600±25 | 800±25 |
7 | Orientation Flat mm | 16±2 | 22±1 | 32.5±1 |
8 | Identification Flat mm | 8±1 | 11±1 | 18±1 |
9 | Mobility cm2/V.s | 200-3500 or as required | ||
10 | Carrier Concentration cm-3 | (1-100)E17 or as required | ||
11 | TTV μm max | 15 | 15 | 15 |
12 | Bow μm max | 15 | 15 | 15 |
13 | Warp μm max | 20 | 20 | 20 |
14 | Dislocation Density cm-2 max | 500 | 1000 | 2000 |
15 | Surface Finish | P/E, P/P | P/E, P/P | P/E, P/P |
16 | Packing | Single wafer container sealed in Aluminum bag. |
Linear Formula | GaSb |
Molecular Weight | 191.48 |
Crystal structure | Zinc blende |
Appearance | Gray crystalline solid |
Melting Point | 710°C |
Boiling Point | N/A |
Density at 300K | 5.61 g/cm3 |
Energy Gap | 0.726 eV |
Intrinsic resistivity | 1E3 Ω-cm |
CAS Number | 12064-03-8 |
EC Number | 235-058-8 |
Gallium Antimonide GaSb at Western Minmetals (SC) Corporation can be offered with n-type, p-type and undoped semi-insulating conductivity in size of 2” 3” and 4” (50mm, 75mm, 100mm) diameter, orientation <111> or <100>, and with wafer surface finish of as-cut, etched, polished or high quality epitaxy ready finishes. All slices are individually laser scribed for identity. Meanwhile, polycrystalline gallium antimonide GaSb lump is also customized upon request to the perfect solution.
Procurement Tips
Gallium Antimonide GaSb