No. | Items | Standard Specification |
1 | Size | 2″ |
2 | Diameter mm | 50.8 0.5 |
3 | Growth Method | LEC |
4 | Conductivity Type | P/Zn, N/S, N/Te, N/un-doped |
5 | Orientation | (111)±0.5° |
6 | Thickness μm | (300-400)±20 |
7 | Resistivity Ω-cm | 0.003-0.3 |
8 | Orientation Flat (OF) mm | 16±1 |
9 | Identification Flat (IF) mm | 8±1 |
10 | Hall Mobility cm2/V.s min | 100 |
11 | Carrier Concentration cm-3 | (2-20)E17 |
12 | Dislocation Density cm-2 max | 2.00E+05 |
13 | Surface Finish | P/E, P/P |
14 | Packing | Single wafer container sealed in Aluminum bag. |
Linear Formula | GaP |
Molecular Weight | 100.7 |
Crystal structure | Zinc blende |
Apperance | Orange solid |
Melting Point | N/A |
Boiling Point | N/A |
Density at 300K | 4.14 g/cm3 |
Energy Gap | 2.26 eV |
Intrinsic resistivity | N/A |
CAS Number | 12063-98-8 |
EC Number | 235-057-2 |
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